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Name: AMAOE BGA Android middle board tin planting positioning Platfrom Plate only
SKU: PRD-6FE0B0C3

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PRD-6FE0B0C3

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10 units

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The AMAOE BGA Android Middle Board Tin Planting Positioning Platform Set is a professional reballing and positioning solution designed for Android motherboard repair. It provides precise alignment and stable positioning during BGA solder ball planting, helping technicians achieve accurate reballing results on CPU, eMMC, UFS, PMIC, and other motherboard chips. The durable platform design improves efficiency and consistency in chip-level repair operations.

Key Features:

Designed for Android motherboard BGA reballing and tin planting.
Precision positioning system ensures accurate chip alignment.
Stable platform minimizes movement during solder ball placement.
Compatible with various Android middle board and motherboard repairs.
High-temperature resistant materials suitable for heating and rework processes.
Enhances solder ball planting accuracy and repair success rates.
Durable construction for long-lasting professional use.
Ideal for chip-level maintenance and advanced repair work

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SKU: N/A

Model: AMAOE BGA

Net Weight: 0 KG

Gross Weight: 0 KG

Variations: 1

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In stock

MOQ: 1

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GSM Bazar

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99.9% Positive Feedback

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AMAOE BGA Android middle board tin planting positioning Platfrom Plate only

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