The AMAOE BGA Platform-U14-SM8150 is a professional reballing and positioning platform designed for Qualcomm Snapdragon SM8150 CPU and RAM chips. Engineered for precise solder ball planting (tin planting), chip alignment, and BGA rework, this platform helps technicians achieve accurate and consistent reballing results during advanced motherboard repairs. This version is supplied without a magnetic base, making it ideal for users who already own a compatible base or require only the platform and positioning components. The U14 platform is specifically intended for SM8150-series CPU and RAM chip repair applications.

Key Features:

• Designed specifically for Qualcomm Snapdragon SM8150 CPU and RAM chips.
• Precision positioning platform for accurate chip alignment.
• Suitable for BGA reballing, solder ball planting, and chip replacement.
• High-temperature resistant construction for professional repair work.
• Improves reballing accuracy and repair efficiency.
• Stable chip positioning during soldering and rework processes.
• Durable and reusable design for long-term workshop use.
• Without magnetic base for flexible workstation compatibility.