AMAOE iPhone 16 Series 4 in 1 Middle Board MBGA Reballing Stencil Platform is a high-precision repair tool designed for motherboard reballing and soldering applications. Engineered specifically for the iPhone 16 series, this 4-in-1 platform combines accurate positioning and reliable support to simplify MBGA reballing procedures. Its professional-grade construction helps technicians achieve precise solder ball placement, improve repair efficiency, and enhance overall repair success rates.

Key Features

• Specially designed for iPhone 16 Series middle board MBGA reballing and repair work.
• 4-in-1 design supports multiple compatible motherboard models in a single platform.
• Provides precise positioning for accurate solder ball alignment and placement.
• High-precision machining ensures reliable and consistent reballing results.
• Durable metal construction offers excellent stability and long service life.
• Helps reduce alignment errors and improves repair accuracy.
• Heat-resistant design withstands temperatures generated during soldering and rework processes.
• Suitable for motherboard repair, chip-level servicing, and professional maintenance applications.
• Ideal for repair technicians seeking efficient and reliable reballing performance.