AMAOE iPhone 16 Series (without Base) 4 in 1 Middle board MBGA Reballing Stencil Platform
Ratings: 4
The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
AMAOE iPhone 16 Series (Without Base) 4 in 1 Middle Board MBGA Reballing Stencil Platform is a precision-engineered repair tool designed for motherboard reballing and soldering applications. Specifically developed for the iPhone 16 Series, this platform provides accurate positioning and stable support for MBGA reballing procedures. Its 4-in-1 design allows compatibility with multiple motherboard models, helping technicians perform efficient and reliable repairs. This version is supplied without a magnetic base, making it suitable for users who already own a compatible base or prefer a customized setup.
Key Features
- Specially designed for iPhone 16 Series middle board MBGA reballing and repair applications.
- 4-in-1 platform supports multiple compatible motherboard models.
- Provides precise motherboard positioning for accurate solder ball placement.
- High-precision machining ensures reliable alignment and consistent repair results.
- Durable metal construction offers excellent strength and long-lasting performance.
- Helps improve reballing accuracy while reducing alignment and soldering errors.
- Heat-resistant design suitable for professional soldering and rework operations.
- Supplied without a magnetic base for flexible integration with existing repair setups.
- Ideal for professional mobile phone repair technicians and chip-level service centers.