AMAOE M1 M2 CPU BGA Reballing Stencil 0.15mm Positioning Board IC Chip Tin Planting Soldering Net Steel Mesh
Ratings: 4
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AMAOE M1 M2 CPU BGA Reballing Stencil 0.15mm Positioning Board is a high-precision soldering stencil designed for M1 and M2 CPU chip reballing and tin planting applications. Manufactured from durable steel mesh, it enables accurate solder ball placement and reliable chip alignment during repair and refurbishment processes. The precision-engineered design helps technicians achieve professional reballing results while improving efficiency and reducing soldering errors.
Key Features
- Specifically designed for M1 and M2 CPU IC chip reballing and tin planting applications.
- Features a precise 0.15mm stencil thickness for accurate solder ball formation.
- High-quality steel mesh construction ensures durability and long service life.
- Provides precise chip positioning for consistent and reliable reballing results.
- Supports uniform solder ball distribution to improve repair quality.
- Heat-resistant design withstands high temperatures during soldering procedures.
- Helps reduce solder bridging and alignment errors during rework.
- Suitable for professional motherboard repair, chip refurbishment, and maintenance work.
- Compact and easy-to-use design enhances repair efficiency and convenience.