AMAOE M11-138 Low temperature 138°C soldering paste
Ratings: 4
The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
The AMAOE M11-138 Low Temperature Soldering Paste is a professional lead-free solder paste specially formulated for BGA reballing, motherboard repair, and precision micro-soldering applications. With a low melting point of 138°C, it is ideal for heat-sensitive electronic components and multi-layer smartphone motherboards, helping reduce the risk of thermal damage during repair operations. The M11 uses a low-temperature Sn42/Bi58 alloy and is commonly supplied in a 50g container.
Key Features:
- Low melting point of 138°C for safer soldering on heat-sensitive components. maintenance. paste consistency for precise application and uniform solder balls. for reliable solder joints. and minimizes heat-related board damage. 0search4
- No-clean flux formula leaves minimal residue after soldering. Commonly used for iPhone motherboard middle-layer and interposer repair work. g container for workshop and professional technician use.