Amaoe PD-C Planting Tin Pad Universal
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Min 1
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Product code
PRD-A9BDBCCB
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The AMAOE PD-C Universal Planting Tin Pad is a professional BGA reballing tool designed for universal solder ball planting (tin planting) and chip alignment applications. Its versatile design supports a wide range of CPU, RAM, eMMC, UFS, PMIC, and other BGA chips, making it an essential tool for chip-level repair technicians. The precision-machined platform ensures stable positioning and accurate solder ball placement for reliable reballing results.
Key Features:
- Universal design compatible with various BGA chip types.
- Precision positioning for accurate solder ball planting.
- Suitable for CPU, RAM, eMMC, UFS, PMIC, and other BGA chips.
- High-temperature resistant construction for professional rework operations.
- Stable platform helps prevent chip movement during reballing.
- Improves repair efficiency and soldering accuracy.
- Durable and reusable design for long-term workshop use.
- Ideal for advanced chip-level motherboard repairs.
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