Amaoe PD-C Planting Tin Pad Universal
Ratings: 4
The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
The AMAOE PD-C Universal Planting Tin Pad is a professional BGA reballing tool designed for universal solder ball planting (tin planting) and chip alignment applications. Its versatile design supports a wide range of CPU, RAM, eMMC, UFS, PMIC, and other BGA chips, making it an essential tool for chip-level repair technicians. The precision-machined platform ensures stable positioning and accurate solder ball placement for reliable reballing results.
Key Features:
- Universal design compatible with various BGA chip types.
- Precision positioning for accurate solder ball planting.
- Suitable for CPU, RAM, eMMC, UFS, PMIC, and other BGA chips.
- High-temperature resistant construction for professional rework operations.
- Stable platform helps prevent chip movement during reballing.
- Improves repair efficiency and soldering accuracy.
- Durable and reusable design for long-term workshop use.
- Ideal for advanced chip-level motherboard repairs.
.