AMAOE STENCIL
Quantity
Min 1
Brand
Product code
PRD-66C987CD
Stock
Warranty
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AMAOE Reballing Stencil is a high-precision soldering template designed for professional BGA reballing, tin planting, and chip repair applications. Manufactured from high-quality steel, it provides accurate solder ball positioning and consistent alignment for a wide range of ICs and motherboard components. Its durable construction and precision-engineered openings help technicians achieve reliable reballing results while improving efficiency during repair and maintenance procedures.
Key Features
- Precision-engineered stencil designed for accurate BGA reballing and tin planting applications.
- Manufactured from high-quality steel for durability and long-term performance.
- Ensures precise solder ball alignment for consistent and reliable repair results.
- Supports uniform solder paste and solder ball distribution across IC pads.
- Heat-resistant construction suitable for high-temperature soldering processes.
- Helps reduce solder bridging, misalignment, and rework during repairs.
- Compatible with various CPU, NAND, EMMC, PMIC, and motherboard repair applications.
- Lightweight and easy-to-use design enhances repair efficiency and convenience.
- Ideal for professional mobile phone repair technicians, electronics engineers, and service centers.