AMAOE UBGA CPU Series tin planting platform Stencil and Platfrom Plate with magnetic Base
Ratings: 4
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The AMAOE UBGA CPU Series Tin Planting Positioning Platform Plate is a precision reballing tool designed for UBGA CPU chip solder ball planting and alignment. Engineered for professional chip-level repair, this positioning plate provides accurate placement and stable support during the reballing process, helping technicians achieve consistent and reliable soldering results on CPU and other UBGA package chips.
Key Features:
- Specifically designed for UBGA CPU series reballing applications.
- Precision positioning system ensures accurate chip alignment.
- Ideal for solder ball planting (tin planting) and rework operations.
- High-temperature resistant construction for professional repair environments.
- Precision-machined plate for improved reballing accuracy.
- Stable support helps reduce chip movement during solder ball placement.
- Durable and reusable design for long-term use.
- Suitable for professional mobile phone and motherboard repair technicians.