AMAOE UBGA CPU Series tin planting platform Stencil and Platfrom Plate without magnetic Base
Ratings: 4
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The AMAOE UBGA CPU Series Tin Planting Platform Stencil & Platform Plate is a professional reballing solution designed for UBGA CPU chip repair and solder ball planting. Combining a precision stencil with a positioning platform plate, this set enables accurate solder ball alignment and efficient reballing of CPU and other UBGA-packaged chips. This version is supplied without a magnetic base, making it ideal for technicians who already have a compatible base or prefer a modular repair setup.
Key Features:
- Designed for UBGA CPU chip solder ball planting and reballing.
- Includes precision stencil and positioning platform plate.
- Ensures accurate solder ball alignment and placement.
- Platform plate provides stable chip positioning during rework.
- High-temperature resistant materials suitable for professional repair operations.
- Precision-manufactured for consistent and reliable results.
- Reusable and durable construction for long-term use.
- Supplied without magnetic base for flexible workstation compatibility.