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Name: AMAOE UBGA CPU Series tin planting platform Stencil and Platfrom Plate without magnetic Base
SKU: PRD-D2FAF09E

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Product code

PRD-D2FAF09E

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10 units

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The AMAOE UBGA CPU Series Tin Planting Platform Stencil & Platform Plate is a professional reballing solution designed for UBGA CPU chip repair and solder ball planting. Combining a precision stencil with a positioning platform plate, this set enables accurate solder ball alignment and efficient reballing of CPU and other UBGA-packaged chips. This version is supplied without a magnetic base, making it ideal for technicians who already have a compatible base or prefer a modular repair setup.

Key Features:

Designed for UBGA CPU chip solder ball planting and reballing.
Includes precision stencil and positioning platform plate.
Ensures accurate solder ball alignment and placement.
Platform plate provides stable chip positioning during rework.
High-temperature resistant materials suitable for professional repair operations.
Precision-manufactured for consistent and reliable results.
Reusable and durable construction for long-term use.
Supplied without magnetic base for flexible workstation compatibility.

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SKU: N/A

Model: AMAOE UBGA

Net Weight: 0 KG

Gross Weight: 0 KG

Variations: 1

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In stock

MOQ: 1

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GSM Bazar

Trusted Seller

99.9% Positive Feedback

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AMAOE UBGA CPU Series tin planting platform Stencil and Platfrom Plate without magnetic Base

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