AMAOE UBGA Tin Planting Magnetic Base is a professional support platform designed for BGA reballing and tin planting operations. Engineered to provide a stable and secure foundation for compatible positioning stencils and platforms, it enhances precision during solder ball planting and chip repair procedures. Its strong magnetic design ensures firm holding power, making it an essential tool for technicians performing advanced motherboard and IC repair work.

Key Features

• Designed to support UBGA tin planting and BGA reballing applications.
• Strong magnetic holding system securely fixes compatible positioning platforms in place.
• Provides a stable working surface for accurate solder ball placement.
• High-quality metal construction ensures durability and long-term reliability.
• Enhances alignment accuracy during chip reballing and repair procedures.
• Heat-resistant design suitable for professional soldering and rework environments.
• Helps reduce movement and positioning errors during tin planting operations.
• Compatible with a wide range of AMAOE BGA positioning platforms and stencils.
• Ideal for mobile phone repair technicians, motherboard specialists, and electronics service centers.