Conductive silver paste is a high-performance, quick-drying conductive material refined from ultra-fine silver powder and low-temperature curing resin . This professional-grade solution is designed to restore electrical conductivity on broken circuit traces, flexible printed circuits (FPC), ITO films, and PCB boards where traditional soldering is not feasible due to heat-sensitive substrates .

Unlike conventional solder which requires high temperatures that can melt or warp delicate plastic and glass components, conductive silver paste cures at low temperatures, making it the ideal solution for repairing smartphones, tablets, laptops, automotive electronics, and other sensitive devices .

Key Features

• High Conductivity & Low Resistance – Formulated with ultra-fine silver powder (silver content typically 60-85%) to ensure excellent electrical conductivity and minimal signal loss .
• Low-Temperature Curing – Cures at temperatures between 120-150°C, safe for heat-sensitive substrates like PET, PI, and flexible circuits .
• Nano-Scale Silver Particles – Particle sizes ranging from <0.1µm to ≤10µm enable precise application on microscopic circuit traces .
• Excellent Adhesion – Strong bonding to various substrates including glass, PET film, ITO-coated materials, ceramics, and standard PCB boards .
• Fast Drying & Curing – Quick-drying formulation cures in 5-25 minutes depending on application method and temperature .
• Superior Oxidation Resistance – Maintains performance integrity over time, ensuring reliable long-term connections .
• Environmentally Friendly Options – Halogen-free formulations available for applications requiring RoHS compliance .