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Name: HHT GW-012 Iphone Board Swap Stencil
SKU: PRD-D7DA336E

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PRD-D7DA336E

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HHT GW-012 iPhone Board Swap Stencil

The HHT GW-012 iPhone Board Swap Stencil is a professional motherboard repair stencil designed for board swapping, middle-layer soldering, and BGA reballing operations. It provides precise alignment and accurate solder ball positioning, helping technicians perform reliable board-level repairs on iPhone motherboards.

Constructed from high-precision steel, the stencil offers excellent durability, heat resistance, and repeated-use performance for professional repair environments.

Key Features:

Designed for iPhone board swap and reballing work
High-precision solder ball positioning
Suitable for middle-layer motherboard repair
Heat-resistant stainless steel construction
Durable and reusable design
Accurate alignment for board-level repairs

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Variations: 1

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GSM Bazar

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99.9% Positive Feedback

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HHT GW-012 Iphone Board Swap Stencil

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