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HHT GW-012 iPhone Board Swap Stencil
The HHT GW-012 iPhone Board Swap Stencil is a professional motherboard repair stencil designed for board swapping, middle-layer soldering, and BGA reballing operations. It provides precise alignment and accurate solder ball positioning, helping technicians perform reliable board-level repairs on iPhone motherboards.
Constructed from high-precision steel, the stencil offers excellent durability, heat resistance, and repeated-use performance for professional repair environments.
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