The KAILIWEI UV-223 is a professional-grade, lead-free and no-clean soldering flux paste, formulated under the trusted (WeiXiuLao) brand for high-precision electronics assembly and repair. This 100g BGA flux paste utilizes a mild rosin formula that ensures excellent wetting, prevents oxidation, and leaves no conductive residue, eliminating the need for post-soldering cleaning. Featuring a high SIR (Surface Insulation Resistance) value and light-colored residue, it is the professional's choice for demanding BGA rework, PCB assembly, and chip-level repairs.

Key Features

1. Lead-Free & No-Clean Formula – This flux paste is lead‑free and designed as a no‑clean product. After soldering, it leaves behind only a minimal, light‑colored, non‑conductive, and non‑corrosive residue that requires no additional cleaning, saving you valuable time on every repair.
2. High SIR (Surface Insulation Resistance) – The flux is engineered with a very high SIR value, meaning the cured residue has excellent insulation properties and causes virtually no electrical interference. This makes it particularly safe for working on sensitive communication products like mobile phones, tablets, and laptops.
3. Excellent Wettability & Easy to Tin – Its high‑activity formula effectively removes oxides and reduces surface tension, significantly improving solder flow and wetting. This results in bright, reliable, and mechanically strong solder joints that are easy to tin.
4. Halogen‑Free & Environmentally Safe – Compliant with RoHS standards, the UV‑223 is halogen‑free and non‑toxic. It produces low smoke levels and keeps the work environment free of unpleasant odors, ensuring a safer and more comfortable workspace.
5. Oxidation Resistant & Stable – The flux prevents oxidation of gold, copper, phosphorus, and bronze components during assembly. Its formulation ensures a clean, smooth welding surface without deterioration or drying, guaranteeing consistent performance with every use.