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The Ma Ant MY-58A is a professional-grade, low-temperature lead-free solder paste specifically formulated for micro-soldering and precise electronic repairs . With a melting point of 158°C, this SnBi alloy paste offers a perfect middle-ground solution—higher than 138°C variants to reduce joint brittleness, yet lower than 183°C leaded paste to protect heat-sensitive components .
This paste is engineered with an upgraded silver-infused formula that significantly enhances conductivity and reduces the risk of false soldering . The 25-40μm fine particle size ensures smooth application, prevents tin bubbling, and provides uniform solder ball formation—critical for BGA reballing and fine-pitch component assembly .
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Model: MY-58A
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Variations: 1
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