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The Ma Ant MY-58A is a professional-grade, low-temperature lead-free solder paste specifically formulated for micro-soldering and precise electronic repairs . With a melting point of 158°C, this SnBi alloy paste offers a perfect middle-ground solution—higher than 138°C variants to reduce joint brittleness, yet lower than 183°C leaded paste to protect heat-sensitive components .
This paste is engineered with an upgraded silver-infused formula that significantly enhances conductivity and reduces the risk of false soldering . The 25-40μm fine particle size ensures smooth application, prevents tin bubbling, and provides uniform solder ball formation—critical for BGA reballing and fine-pitch component assembly .
Key Features
158°C Low Melting Point – Provides a balance between thermal protection for sensitive components and reliable joint strength; protects CPUs, plastic connectors, and flex cables during micro-soldering operations
Silver-Infused Lead-Free Alloy (SnBi + Ag) – The upgraded formula contains silver particles that greatly improve conductivity and reduce virtual soldering, delivering superior electrical performance
Fine 25-40μm Particle Size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components and BGA balls
No-Clean Flux Formula – Leaves minimal residue after soldering, reducing post-solder cleaning requirements; high-activity flux ensures excellent wetting and adhesion
Smooth & Uniform Texture – Fine and sticky consistency prevents tin bubbling and ensures uniform solder ball formation, resulting in firm, reliable joints
