The MECHANIC ZC50 Solder Paste is a professional-grade, medium-temperature solder paste specifically formulated for SMD soldering, BGA reballing, and mobile phone motherboard repair . With a melting point of 158°C, this paste occupies the critical mid-range temperature slot—lower than standard lead-free SAC alloys (217°C) to protect sensitive boards, yet higher than ultra-low temp alloys (138°C) to deliver stronger, more reliable joints.

Key Features

• 158°C Medium Melting Point – Provides balanced thermal performance; protects heat-sensitive components while delivering strong, reliable joints 
• Lead-Based Alloy (Sn52Pb42.5Bi3Sb0.5) – Contains tin, lead, bismuth, and antimony for superior wettability and shiny, reliable solder joints 
• IPX6 Flux Rating – High-activity flux with excellent oxidation resistance, at least twice as effective as standard solder pastes 
• No-Clean Formula – Leaves minimal, non-corrosive residue on PCBs; no post-solder cleaning required in most applications 
• Bright, Full Solder Joints – Produces shiny, high-strength joints with strong solder climbing and excellent conductivity 
• Long Storage Life After Opening – Enhanced formula provides extended shelf life even after the container has been opened 
• Fine 4.3# Particle Size – Precision-graded powder ensures smooth application and consistent performance on fine-pitch components