MIJING iRepair HY-258 LO Soldering Oil, Solder Flux Paste
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The MIJING HY-258 LO Soldering Oil is a professional no-clean flux paste designed for high-precision electronics repair, including mobile phone motherboard work, IC reballing, BGA soldering, and PCB rework. It improves solder flow, enhances wetting performance, and helps achieve clean, strong, and stable solder joints. The flux is formulated to reduce oxidation during heating while ensuring smooth solder distribution on fine-pitch components, making it ideal for microsoldering and chip-level repair tasks.
Features
- No-clean flux formula designed for professional electronics repair and PCB maintenance.
- Improves solder wetting and flow for smoother and more reliable solder joints.
- Reduces oxidation during soldering and helps protect PCB pads and IC surfaces.
- Suitable for BGA reballing, motherboard repair, IC rework, and pad cleaning.
- Syringe-style packaging allows precise and controlled application on small components.
- Low-residue design leaves cleaner joints and reduces post-repair cleaning effort.
- Compatible with leaded and lead-free soldering processes.
- Helps prevent solder bridging and improves accuracy in fine-pitch work.
- Widely used in mobile phone repair shops and microsoldering stations.
- Enhances overall repair efficiency and soldering stability in chip-level work.
