The MIJING iRepair MS1 15 Series Plate is a dedicated expansion module designed for the MIJING iRepair MS1 Pre-Heating Station. Specifically engineered for the iPhone 15 Series, this precision heating plate supports motherboard layer separation, CPU maintenance, IC repair, NAND operations, and advanced chip-level servicing. With accurate positioning and optimized heat transfer, the MS-15 module ensures safe and efficient motherboard heating while reducing the risk of PCB damage during repair procedures. It is an essential upgrade accessory for technicians performing professional iPhone 15 series motherboard repairs.

Features

• Specially designed for iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max motherboard repairs.
• Compatible with the MIJING iRepair MS1 multifunction pre-heating station.
• Supports motherboard layer separation and board-level maintenance procedures.
• Ideal for CPU removal, IC repair, NAND work, and chip replacement operations.
• Precision positioning design ensures accurate motherboard alignment during heating.
• Optimized heat transfer provides stable and even heating performance.
• Helps reduce motherboard deformation and repair risks during separation processes.
• Fast installation and removal for improved repair efficiency.