The MIJING iRepair MS1 Pre-Heating Station is a professional multifunction desoldering and motherboard preheating platform designed for advanced iPhone motherboard repair, CPU removal, IC maintenance, NAND work, and layer separation. Equipped with intelligent temperature control, rapid heating technology, and interchangeable model-specific modules, the MS1 provides safe, precise, and efficient heating for motherboard disassembly and chip-level repair operations. Its upgraded heating system ensures stable temperature output while minimizing the risk of motherboard damage, making it an essential tool for professional mobile repair technicians.

Features

• Supports iPhone X through the latest iPhone series with interchangeable upgrade modules.
• Designed for motherboard layer separation, CPU removal, IC repair, NAND maintenance, and glue removal.
• Newly upgraded heating element delivers fast and stable temperature rise.
• Intelligent temperature control provides accurate and consistent heating performance.
• Digital temperature display allows precise monitoring during repair operations.
• Rapid heating system can reach working temperature within minutes for improved efficiency.
• Countdown timer function enhances safety and repair precision.
• Intelligent 15-minute sleep mode helps prevent overheating and saves energy.
• Precise positioning design ensures accurate motherboard alignment during heating.
• Supports Face ID, camera module, fingerprint, CPU, and dot-matrix heating modules.
• Modular design allows future upgrades for newer iPhone models.
• Non-slip weighted platform improves stability during repair procedures.
• Safe motherboard separation system helps reduce the risk of PCB damage.
• Suitable for microscope-assisted repairs, chip rework, soldering, and professional board-level maintenance.
• Durable professional-grade construction built for long-term repair shop use.