The MIJING M21 Universal Magnetic Base is a professional motherboard reballing fixture designed for mobile phone BGA chip repair, middle-layer soldering, and IC tin planting work. It features a strong magnetic base system that securely holds BGA stencils in place, allowing precise alignment during solder ball placement and rework operations. Built with heat-resistant and durable materials, the M21 base ensures stable performance during hot air soldering and microscope-assisted motherboard repairs. It is widely used for iPhone and Android chip-level repair, including CPU, NAND, and IC reballing tasks.

Features

• Universal magnetic base designed for BGA reballing and motherboard middle-layer repair.
• Strong magnetic adsorption system securely holds steel mesh stencils in place.
• Compatible with iPhone, Android, and various smartphone motherboard repair workflows.
• Supports CPU, IC, NAND, and BGA chip tin planting and solder ball formation.
• Heat-resistant construction suitable for hot air rework and soldering station use.
• Provides stable and accurate stencil positioning for precise reballing results.
• Helps reduce movement and errors during solder paste application and heating.
• Designed for professional microsoldering and chip-level repair technicians.
• Durable metal and silicone-based structure for long-term workshop use.
• Improves efficiency and accuracy in motherboard restoration and reballing processes.
• Compact, easy-to-use design suitable for repair benches and microscope setups.
• Works with multiple M21 stencil sets for different device models and chip layouts.