The MIJING MJ158A is a professional-grade, medium-temperature lead-free solder paste specifically formulated for BGA rework, SMD soldering, and PCB assembly . With a melting point of 158°C, this silver-containing paste provides an optimal balance between protecting heat-sensitive components and ensuring reliable, high-strength solder joints.

This paste is engineered with a high-purity formula that delivers excellent wettability and consistent flow characteristics, ensuring stable and reliable solder joints every time . The improved formula reduces the risk of false soldering and cold joints, giving technicians confidence when reballing BGA chips or reflowing components on delicate circuit boards .

Key Features

• 158°C Medium Melting Point – Provides balanced thermal performance; lower than standard lead-free SAC alloys (217°C) to protect sensitive boards, yet higher than ultra-low temp alloys (138°C) for stronger joint integrity
• Silver-Containing Formula – Infused with silver particles to enhance electrical conductivity and reduce contact resistance, ideal for high-frequency circuits and CPU reballing applications
• High-Purity Tin Alloy – Professional-grade formulation delivers excellent wettability and consistent flow characteristics for stable, reliable solder joints 
• No-Clean Flux System – Features a low-residue, non-corrosive flux that provides strong oxidation removal while minimizing post-solder cleanup
• Reduced Risk of False Soldering – Enhanced formula specifically designed to minimize cold joints and false soldering, ensuring confident, repeatable results on BGA chips and fine-pitch components