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MIJING MJ190A 190°C medium temperature, silver containing solder paste
Ratings: 4
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The MIJING MJ190A is a professional-grade, medium-temperature solder paste specifically formulated for precise rework and assembly of electronic components.
Operating at a melting point of 190°C, this paste fills the critical gap between low-temperature (138°C) and standard lead-free (217°C) options [citation:1]. It reduces thermal stress on sensitive boards while offering higher reliability than ultra-low-temp pastes. The silver-enhanced alloy significantly improves the electrical conductivity and mechanical strength of the solder joints, making it ideal for maintaining signal integrity in smartphones, tablets, and laptop motherboards .
Key Features
- Optimized 190°C Melting Profile: Strikes a balance between protecting heat-sensitive components and achieving reliable high-strength joints .
- Silver Additive for Conductivity: Infused with silver particles to ensure low resistance and excellent performance in high-frequency circuits.
- No-Clean Flux System: Features a high-activity, halogen-free flux that provides aggressive oxidation removal while leaving minimal, non-corrosive residue.
- Fine Pitch Performance: Engineered with Type 3 or Type 4 powder (25-45µm), ensuring smooth release from stencils for 0.4mm pitch BGA and fine-pitch SMD placement.
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