The MIJING T23 MAX is a professional triaxial motherboard repair fixture designed for mobile phone PCB, CPU, and IC soldering operations. Featuring a three-axis adjustable clamping system, it securely holds motherboards and chips in place during maintenance, rework, and BGA soldering. Its anti-slip design, high-temperature resistance, and precision locking mechanism provide excellent stability and control, making it an essential tool for professional mobile repair technicians. The T23 MAX is compatible with a wide range of smartphone motherboards and is ideal for soldering, chip replacement, de-gluing, and board-level repairs.

Features

• Triaxial (3-Axis) Clamping System – Provides stable and precise motherboard positioning during repair.
• Universal Compatibility – Suitable for iPhone, Android, and various mobile phone motherboards.
• Rotary Locking Design – Securely locks PCBs and ICs without rebound or movement.
• Adjustable Fixture Positioning – Multiple height and distance adjustment options for different board sizes.
• Anti-Slip Base Design – Prevents fixture movement and improves work stability.
• Heat-Resistant Construction – Designed to withstand high temperatures during soldering and rework processes.
• Enhanced Heat Dissipation – Special structure allows hot air to circulate efficiently during repairs.
• IC & CPU Repair Support – Ideal for chip reballing, soldering, de-gluing, and maintenance tasks.
• Durable Metal Construction – Built for long-term professional repair use.
• Professional Repair Tool – Perfect for motherboard-level repairs, BGA work, and electronic component servicing.