The MIJING Z20 Pro 22 IN 1 Middle Layer Reballing Platform is a professional BGA reballing and motherboard repair fixture designed for iPhone X through iPhone 15 Series devices. Featuring a precision magnetic positioning system, high-accuracy steel stencils, and a multi-model modular platform, it enables fast, stable, and accurate middle-layer tin planting and motherboard reballing. Built for advanced microsoldering and chip-level repairs, the Z20 Pro helps technicians achieve consistent solder ball formation while reducing the risk of motherboard damage during rework procedures.

Features

• Supports iPhone X, XR, XS, XS Max, 11, 12, 13, 14, and 15 Series motherboards.
• 22-in-1 multifunction platform covers multiple motherboard models with one repair system.
• Designed for middle-layer BGA reballing, tin planting, and motherboard restoration.
• Precision positioning structure ensures accurate motherboard alignment during repair.
• Strong magnetic adsorption system securely fixes the motherboard and stencil in place.
• High-precision steel mesh stencils improve solder ball consistency and accuracy.
• Rounded stencil hole design helps create full and uniform solder balls.
• Modular expansion design allows easy replacement and upgrading of stencil modules.
• Fast stencil installation and removal improve repair workflow efficiency.
• Durable metal and high-quality steel construction ensure long-term professional use.
• Suitable for microscope-assisted microsoldering, chip replacement, and advanced board-level repairs.
• Helps achieve precise solder ball placement for reliable motherboard restoration results.