The MIJING Z20 Pro Middle Layer Reballing Platform is a professional BGA reballing and motherboard soldering fixture specially designed for iPhone 15 Series motherboard middle-layer repair and tin planting operations. Engineered for precise PCB positioning and stable stencil alignment, it enables accurate solder ball formation while reducing errors during reballing procedures. Its high-temperature resistant construction and integrated positioning system provide secure motherboard fixation, making it ideal for chip-level repair, motherboard restoration, and advanced microsoldering applications. Designed for professional technicians, the Z20 Pro offers a reliable solution for efficient and damage-free iPhone 15 series motherboard reballing.

Features

• Designed specifically for iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max motherboard middle-layer reballing.
• 4-in-1 reballing platform supports multiple iPhone 15 series motherboard models.
• Precision positioning system ensures accurate motherboard alignment during soldering.
• Integrated steel mesh stencil design improves BGA reballing accuracy and efficiency.
• Provides stable motherboard fixation to prevent movement during repair operations.
• High-temperature resistant construction suitable for hot air and soldering station use.
• Supports middle-layer tin planting, BGA solder ball formation, and motherboard restoration.
• Reduces the risk of motherboard damage during reballing procedures.
• Convenient stencil installation and removal for faster repair workflow.
• Suitable for CPU, IC, NAND, and motherboard-level soldering repairs.
• Compact and professional design ideal for microscope-assisted repair environments.
• Durable metal construction ensures long-term reliability in repair shops.