The OSS TEAM W120+ IC Chip Knife is a professional motherboard repair tool specially designed for IC chip removal, CPU glue cleaning, BGA rework, and PCB maintenance. Featuring an ultra-thin precision blade, it allows technicians to safely remove black glue, separate IC chips, and perform delicate motherboard repairs without damaging surrounding components. The blade is manufactured using cryogenic treatment technology and high-carbon steel, providing excellent toughness, flexibility, and durability.

Designed for professional mobile phone repair, the W120+ features a reinforced anti-slip handle with textured grip for improved control during precision operations. Its ultra-thin blade can easily slide between the chip and motherboard, making it ideal for CPU, NAND, baseband, and BGA chip repair work. The blade is thinner than typical solder points, allowing smooth and controlled movement during chip removal procedures.

The ergonomic design and precision-engineered blade help technicians perform glue removal, adhesive cleaning, and chip separation efficiently while minimizing the risk of PCB damage. It is widely used in mobile phone repair workshops, motherboard repair centers, and electronics servicing environments.

Key Features:

• Professional IC chip and CPU removal tool
• Ultra-thin high-carbon steel blade
• Cryogenic-treated blade for enhanced toughness
• Ideal for black glue and adhesive removal
• Anti-slip textured handle design
• Precise and controlled chip separation
• Suitable for BGA, CPU, NAND, and IC repair
• Flexible and durable blade construction
• Easy blade installation and replacement
• Designed for professional motherboard repair work