The QUICK 857DW+ is a professional-grade SMD hot air rework station engineered for precision desoldering, BGA reballing, and component removal on mobile phone motherboards, PCBs, and electronic assemblies. Powered by a 580W heating system with a built-in air pump (not a handle fan), this station delivers high-volume, stable airflow (up to 120 L/min) that prevents delicate SMD components from being displaced during rework . 

Key Features

• 580W High Power Output – Delivers rapid heating and efficient thermal performance for SMD desoldering, BGA reballing, and component removal .
• 100°C to 450°C Temperature Range with 1°C Resolution – Digital LED display provides precise temperature control with ±1°C accuracy, suitable for delicate SMD components to lead-free soldering applications .
• Stepless Airflow Adjustment (1-8 Levels / 20-120 L/min) – Built-in air pump with dual vortex flow ensures uniform temperature distribution and stable heating unaffected by airflow changes .
• Magnetic Induction Handle with Auto Standby – Electromagnetic sensor detects when handle is placed on stand; system automatically enters sleep mode and returns to standby, extending heater life .
• 4 Interchangeable Nozzles Included – Comes with 4 nozzle sizes (3.0mm, 6.3mm, 8.3mm, 12.0mm) for versatile component coverage from fine-pitch ICs to larger BGA chips .