The QUICK 861 Pro is a professional-grade smart hot air desoldering station engineered for precision BGA rework, SMD desoldering, and IC chip removal on mobile phone motherboards and PCB assemblies . Featuring a powerful 1300W heating system with smart PID temperature control, this station delivers exceptional thermal performance with fast heat-up and ±1°C accuracy.

Key Features

• 1300W High-Power Output – Delivers rapid heating and exceptional thermal performance for professional SMD desoldering, BGA reballing, and PCB rework 
• Smart PID Temperature Control – Provides precise temperature regulation with advanced PID algorithm, ensuring consistent heat distribution and protecting sensitive components 
• AI Voice Control – Hands-free operation with voice command functionality for temperature adjustments and power management, ideal for multitasking environments 
• Extended 50-550°C Temperature Range – Wide operating range suitable for everything from delicate SMD components to high-temperature lead-free soldering applications 
• Brushless Vortex Fan with 70L/min Airflow – Provides uniform, low-pressure airflow with reduced noise, long service life, and 1-200 stepless air volume adjustment 
• OLED HD Full-View Display – Bright, high-resolution screen with complete viewing angle for real-time temperature and parameter monitoring