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QUICK 861 Pro SMD Smart Hot Air Desoldering Station | Go Dokan | Godokan

QUICK 861 Pro SMD Smart Hot Air Desoldering Station

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The QUICK 861 Pro is a professional-grade smart hot air desoldering station engineered for precision BGA rework, SMD desoldering, and IC chip removal on mobile phone motherboards and PCB assemblies . Featuring a powerful 1300W heating system with smart PID temperature control, this station delivers exceptional thermal performance with fast heat-up and ±1°C accuracy.

Key Features

1300W High-Power Output – Delivers rapid heating and exceptional thermal performance for professional SMD desoldering, BGA reballing, and PCB rework
Smart PID Temperature Control – Provides precise temperature regulation with advanced PID algorithm, ensuring consistent heat distribution and protecting sensitive components
AI Voice Control – Hands-free operation with voice command functionality for temperature adjustments and power management, ideal for multitasking environments
Extended 50-550°C Temperature Range – Wide operating range suitable for everything from delicate SMD components to high-temperature lead-free soldering applications
Brushless Vortex Fan with 70L/min Airflow – Provides uniform, low-pressure airflow with reduced noise, long service life, and 1-200 stepless air volume adjustment
OLED HD Full-View Display – Bright, high-resolution screen with complete viewing angle for real-time temperature and parameter monitoring