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Ratings: 4

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RELIFE HW31 Conductive Silver Paste (0.2 mL) is a premium-grade conductive adhesive designed for high-performance electrical connectivity in electronics assembly, repair, and prototyping. With a compact 0.2 mL syringe, HW31 delivers precise application, outstanding conductivity, and strong adhesion—ideal for fine circuitry and surface-mount electronic work where accuracy matters.
Formulated with silver particles suspended in a specialized binder, this conductive paste offers excellent electrical performance, low resistance, and reliable bonding between components or traces. Whether you’re repairing broken PCB traces, creating jumpers, or enhancing grounding paths, HW31 provides consistent results with minimal residue.
SKU: N/A
Model: HW31
Net Weight: 9.6 G
Gross Weight: N/A
Variations: 1
Serial Number: N/A
Product Size: 20 * 10 * 122 CM
Package Size: N/A
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