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RELIFE RL-039 BGA-IC High-effect Adhesive Remove Liquid
Ratings: 4
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The RELIFE RL-039 is a professional-grade, high-effect adhesive remover liquid specifically formulated for BGA IC chip repair, motherboard maintenance, and PCB preparation. This 20ml solution is expertly designed to dissolve and soften hardened black glue, epoxy resin, and other sealants used in electronic component assembly.
Key Features
- Effective black glue removal – Specifically formulated to dissolve and soften epoxy, phenolic, acrylic, polyurethane, and silicone resin sealants commonly used on BGA IC chips and motherboards
- Gentle, non-corrosive formula – Removes adhesive residues without damaging sensitive electronic components, PCBs, or copper foil circuits
- 20ml compact bottle – Professional size perfect for repair shop workbenches; easy to handle and store
- Fast-acting chemical composition – Quickly penetrates and loosens hardened adhesives, reducing wait time during IC removal procedures
- Eco-friendly formulation – Made with environmentally conscious materials; non-flammable for safe workshop use
- Easy application – Liquid form can be applied using a brush, pipette, or by soaking a cotton ball
- Residue-free cleaning – Leaves surfaces clean and ready for further processing or assembly after proper washing
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