Achieve professional BGA reballing results with the RELIFE RL-088 Magnetic Reballing Platform, a precision fixture designed for technicians who demand accuracy and stability during chip positioning, soldering, and motherboard repair.

Key Features

• Magnetic Holding System – Securely holds chips and stencils firmly in place during tin planting (reballing) for maximum stability
• Precision Alignment – Ensures accurate positioning of BGA components and stencils, resulting in professional-grade solder ball placement
• Designed for BGA Soldering – Ideal for chip positioning, motherboard repair, and reballing applications
• Stable Working Platform – Eliminates shifting and movement during delicate reballing procedures
• Professional-Grade Construction – Built for use in repair shops, service centers, and advanced electronics workstations
• Improves Accuracy & Efficiency – Reduces errors and speeds up the reballing process by maintaining perfect alignment throughout