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RELIFE RL-402 solder paste /40G/183℃ | Go Dokan | Godokan

RELIFE RL-402 solder paste /40G/183℃

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The RELIFE RL-402 is a professional-grade, no-clean solder paste specifically formulated for BGA reballing, SMD/SMT assembly, and mobile phone motherboard repair. With a melting point of 183°C, this Sn63/Pb37 (63% tin, 37% lead) alloy paste delivers strong, reliable solder joints with a bright, full finish .

Key Features

183°C melting point – Medium-temperature leaded solder paste, ideal for general electronics repair, BGA reballing, and SMD/SMT component assembly
Sn63/Pb37 alloy composition – 63% tin, 37% lead; provides excellent wettability, strong solder joints, bright and full soldering appearance
Fine 20-38μm particle size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components and BGA balls
No-clean formula – Minimal flux residue after soldering; reduces post-solder cleaning time and simplifies workflow
Optimal viscosity (160-230 Pa·s) – Thick, stable consistency keeps paste in place during application; resists spreading and slumping
High activity flux – Ensures strong bonding, good oxidation removal, and reliable solder joints even on slightly oxidized pads
40g professional packaging – Generous quantity for regular repair work; economical choice for repair shops and frequent users