The GOOT CP-20B is a professional-grade, bulk-length desoldering wick from Taiyo Electric Ind. Co., the manufacturer of the globally trusted GOOT brand. Engineered for high‑volume rework and industrial applications, this 30‑meter long spool with a 2.0mm width provides exceptional value and performance for technicians who demand consistency. Featuring a flat‑braid design, RMA flux, and RoHS 2 compliance, the CP‑20B offers efficient, residue‑minimised solder removal while being ESD‑safe and lead‑free compatible. It is the ultimate choice for high‑throughput repair shops, electronics manufacturing, and professional maintenance environments.

Key Features

30‑Meter Bulk Spool for High‑Volume Work – With a generous 30‑metre length, this spool is designed for extended, uninterrupted desoldering sessions. It eliminates the need for frequent wick changes, making it ideal for high‑throughput repair shops, production lines, and PCB assembly environments.
2.0mm Flat‑Braided Width – The 2.0mm width strikes the perfect balance between precision and coverage. It is wide enough to efficiently clear standard PCB pads and through‑holes, yet narrow enough to access fine‑pitch IC pins, BGA pads, and dense component layouts found in smartphones, laptops, and medical devices.
RMA Flux with Low Ionic Residue – Factory‑saturated with a specialised RMA (Rosin Mildly Activated) flux that contains no corrosive chloride. The formulation activates at soldering temperatures to remove oxides and enhance capillary action, leaving minimal, non‑conductive residue that will not leave ionic contamination on boards—critical for aerospace, medical, and telecommunications applications.
ESD‑Safe Construction – Engineered with anti‑static properties to protect sensitive electronic components from electrostatic discharge (ESD) damage. This feature is essential for working with modern MOSFETs, microprocessors, and other static‑sensitive devices found in professional repair environments.
Efficient Thermal Transmission – The thin, soft flat braid ensures rapid heat transfer, enabling faster solder removal with better heat response than previous wick designs. This minimises the time the soldering iron remains on the board, reducing the risk of lifted pads and thermally damaged components.

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