The RELIFE RL-406 is a professional-grade, high-temperature lead-free solder paste specifically formulated for advanced electronics repair, BGA reballing, and motherboard-level work. With a melting point of 227°C, this high-purity silver-based alloy paste is ideal for modern lead-free soldering applications, including iPhone 12 series middle-layer tin planting and other high-precision rework tasks . 

Key Features

• 227°C high-temperature melting point – Lead-free formula specifically designed for modern electronics, suitable for iPhone 12/12 Pro/12 Pro Max middle-layer tin planting and BGA reballing 
• Silver-based, lead-free alloy composition – High-purity alloy provides excellent conductivity, strong joints, and stable soldering performance 
• Fine 20-38μm particle size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components and BGA balls 
• Excellent wetting ability – Maintains surface wetness even after 36 hours of opening without affecting soldering quality 
• No-clean formula – Minimal flux residue after soldering; reduces post-solder cleaning time 
• Strong soldering performance – High activity, strong bonding, bright and full tin joints with good mechanical strength 
• High purity and delicate stickiness – Temperature is accurate, effectively protects circuit board components during soldering