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RELIFE RL-406 high temperature lead-free tin paste
Ratings: 4
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The RELIFE RL-406 is a professional-grade, high-temperature lead-free solder paste specifically formulated for advanced electronics repair, BGA reballing, and motherboard-level work. With a melting point of 227°C, this high-purity silver-based alloy paste is ideal for modern lead-free soldering applications, including iPhone 12 series middle-layer tin planting and other high-precision rework tasks .
Key Features
- 227°C high-temperature melting point – Lead-free formula specifically designed for modern electronics, suitable for iPhone 12/12 Pro/12 Pro Max middle-layer tin planting and BGA reballing
- Silver-based, lead-free alloy composition – High-purity alloy provides excellent conductivity, strong joints, and stable soldering performance
- Fine 20-38μm particle size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components and BGA balls
- Excellent wetting ability – Maintains surface wetness even after 36 hours of opening without affecting soldering quality
- No-clean formula – Minimal flux residue after soldering; reduces post-solder cleaning time
- Strong soldering performance – High activity, strong bonding, bright and full tin joints with good mechanical strength
- High purity and delicate stickiness – Temperature is accurate, effectively protects circuit board components during soldering
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