The RELIFE RL-406S is a professional-grade, lead-free high-temperature solder paste specifically formulated for advanced electronics repair, BGA reballing, and motherboard-level work. With a melting point of 227°C, this Sn99/Ag0.3/Cu0.7 (tin-silver-copper) alloy paste is ideal for modern lead-free soldering applications, including iPhone 12 series middle-layer tin planting and other high-precision rework tasks .

• 227°C high-temperature melting point – Lead-free formula specifically designed for modern electronics, suitable for iPhone 12/12 Pro/12 Pro Max middle-layer tin planting and BGA reballing 
• High-purity silver-based alloy – Sn99/Ag0.3/Cu0.7 composition (99% tin, 0.3% silver, 0.7% copper) provides excellent conductivity and strong, reliable solder joints 
• Fine 20-38μm particle size – Ensures smooth paste flow and accurate soldering on fine-pitch components, small pads, and micro-components 
• No-clean formula – Leaves minimal residue, reducing post-solder cleaning time while maintaining excellent wettability 
• Excellent wetting ability – Maintains surface wetness even after 36 hours of opening without affecting soldering quality 
• Optimal viscosity (160-230 Pa·s) – Easy to apply with precise control, stays in place without running 
• Syringe packaging with accessories – 10cc syringe includes matching needle tips, plunger, and protective cap for precise, waste-free application