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RELIFE RL-406S 227℃ SOLDER PASTE 10cc
Ratings: 4
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The RELIFE RL-406S is a professional-grade, lead-free high-temperature solder paste specifically formulated for advanced electronics repair, BGA reballing, and motherboard-level work. With a melting point of 227°C, this Sn99/Ag0.3/Cu0.7 (tin-silver-copper) alloy paste is ideal for modern lead-free soldering applications, including iPhone 12 series middle-layer tin planting and other high-precision rework tasks .
- 227°C high-temperature melting point – Lead-free formula specifically designed for modern electronics, suitable for iPhone 12/12 Pro/12 Pro Max middle-layer tin planting and BGA reballing
- High-purity silver-based alloy – Sn99/Ag0.3/Cu0.7 composition (99% tin, 0.3% silver, 0.7% copper) provides excellent conductivity and strong, reliable solder joints
- Fine 20-38μm particle size – Ensures smooth paste flow and accurate soldering on fine-pitch components, small pads, and micro-components
- No-clean formula – Leaves minimal residue, reducing post-solder cleaning time while maintaining excellent wettability
- Excellent wetting ability – Maintains surface wetness even after 36 hours of opening without affecting soldering quality
- Optimal viscosity (160-230 Pa·s) – Easy to apply with precise control, stays in place without running
- Syringe packaging with accessories – 10cc syringe includes matching needle tips, plunger, and protective cap for precise, waste-free application
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