The AMTECH NC-559-ASM is a professional-grade, no-clean tacky flux paste widely recognized as a global industry standard for high-precision electronics assembly and repair. Formulated by Advanced Metals Technology Inc, this 100g jar is specifically engineered for demanding operations like BGA (Ball Grid Array) reballing, SMD rework, and smartphone motherboard repairs. It features ROL0 classification, zero halogen content, and a UV tracer for quality inspection, all while leaving virtually no residue—eliminating the need for post-soldering cleaning.

Key Features

No-Clean & ROL0 Classification – This flux features a ROL0 classification, indicating low-activity, rosin-based, and zero-halogen formulation. After the soldering process, the residue is chemically inert, non-corrosive, and non-conductive, eliminating the mechanical necessity of cleaning the PCB—a critical advantage for high-density components where cleaners might get trapped.
High Viscosity with "Tackiness" – The paste features a thick, gel-like consistency with high tackiness that serves a functional purpose: it securely holds small SMD components and BGA spheres in place before heat is applied, preventing them from shifting due to air pressure from a hot air station.
UV Tracer for Quality Inspection – The flux contains a UV-active additive that fluoresces under ultraviolet light, allowing quality control teams to verify that the flux was applied and distributed correctly across the board before soldering, reducing costly rework.
Clear, Minimal Residue with High SIR – The residue remains clear and transparent after heating, allowing for easy visual inspection of solder joints. It has a high Surface Insulation Resistance (SIR), remaining non-conductive after curing and ensuring no electrical leakage even on fine-pitch boards.
Excellent Wetting & Thermal Stability – The flux provides superior wetting properties, allowing solder to flow smoothly over pads and component leads, and remains thermally stable under high temperatures, preventing premature "drying out" during extended hot air rework or infrared reflow cycles.

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