The RELIFE RL-429 TPF(UV) Solder Flux is a professional-grade, high-activity flux paste specifically formulated for BGA soldering, PCB repair, and precision electronics work. This 20ml hose-type flux features a unique TPF(UV) formulation that allows for UV-curable positioning and inspection, making it ideal for complex BGA reballing and chip placement applications where precise alignment verification is critical. The transparent flux paste is made with imported raw materials and exhibits strong activity for excellent wetting and fast tinning while remaining non-corrosive to delicate circuit boards.

Key Points

• TPF(UV) technology – UV-curable formulation allows for position verification under UV light
• High activity – Strong flux activation for excellent wetting and fast tinning
• Imported raw materials – Premium quality for professional results
• Transparent formula – Clear visibility of components during placement
• Non-corrosive – Safe for sensitive PCBs and BGA pads
• 20ml hose packaging – Flexible tube with long nozzle for precise application
• Easy to use in tight spaces – Long nozzle design reaches small work areas
• Perfect for BGA work – Ideal for BGA reballing, IC replacement, and CPU repair
• No virtual welding – Ensures reliable solder connections