Elevate your chip-level repair capabilities with the SUNSHINE SS-T12A FACE V2.0 Motherboard Heating Machine, an intelligent heating platform engineered for precision mobile phone motherboard repair and advanced micro-soldering applications.

Key Features

• Upgraded FACE V2.0 Version – Enhanced temperature stability and uniform heat distribution for safe, controlled PCB heating
• Precision Digital Temperature Control – High-precision system enables accurate heat adjustment for various repair tasks
• Versatile Repair Capabilities – Ideal for IC removal, soldering, glue cleaning, layered board separation, and chip-level maintenance
• Secure Clamp System – Integrated clamps keep motherboards firmly in place during operation for stable, hands-free work
• Large Heating Platform – Accommodates various motherboard sizes, from smartphones to tablets and other compact electronics
• High Thermal Conductivity – Fast heat transfer with minimal heat loss for efficient and consistent performance
• Safety Features – Overheat protection and stable power management ensure safe operation during extended working sessions
• Component Protection – Controlled heating prevents damage to sensitive components such as CPU, NAND, and baseband chips