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The Tribe Tool Non‑metallic BGA Pry Rod is specifically designed for safe chip extraction on multi‑layer PCBs. When reballing or replacing components like CPUs, NAND memory, or other BGA ICs, the PCB is subjected to high heat. Unlike metal pry tools that conduct heat and can damage surrounding pads or traces, this non‑metallic rod provides a safe, heat‑resistant fulcrum. It allows technicians to gently lift components once the solder has reflowed, significantly reducing the risk of tearing pads or scratching the board surface [citation:1].
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