This solder paste is specifically formulated for lead-based soldering processes, featuring a precise melting point of 183°C (361°F). The eutectic composition ensures it transitions directly from solid to liquid without a plastic phase, which is ideal for rapid reflow and precision placement of Surface Mount Devices (SMD).

The "WL" series is recognized for its balance of flux activity and residue characteristics, making it a staple in repair benches for general electronics maintenance.

✨ Key Features

• Standard Melting Point: 183°C ensures compatibility with lead-based alloys (like Sn63/Pb37), providing excellent thermal stability for motherboard and SMD repairs.
• High Wettability: The tin slurry formulation offers superior spreading ability on copper pads, ensuring strong metallurgical bonding without de-wetting.
• Fine Pitch Applicability: The paste rheology is designed to meet the demands of fine-pitch components (down to 0.4mm), preventing bridging during reflow.
• Minimal Solder Balls: High-quality flux controls oxide formation, significantly reducing the occurrence of stray solder beads around joints.
• Excellent Stencil Life: Maintains viscosity on the stencil, allowing for consistent print volumes over prolonged periods, reducing waste.