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The WL HT007 Intelligent Soldering Station Pre-Heating Platform is a professional motherboard repair system designed for precise preheating, separation, and IC-level repair of iPhone X to iPhone 14 Pro Max series devices. It is widely used in advanced mobile repair workshops for layered motherboard work.
The system provides stable temperature control, fast heating, and accurate alignment using interchangeable mould and stencil sets, making motherboard separation and reballing safer and more efficient.
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