The XZZ Motherboard Layered Test PCB Separation Fixture is a professional 4-in-1 integrated testing tool specifically designed for troubleshooting and repairing "sandwich" style (layered/tiered) motherboards found in modern iPhones . This fixture allows technicians to perform functional tests on the upper and lower layers of an iPhone motherboard separately, eliminating the need for complex manual wiring or guesswork when diagnosing baseband, power, or logic faults.

Key Features

• Wide Model Compatibility (iPhone X to 16 Series) – Supports iPhone X, XS, XS Max, XR, 11 series, 12 series, 13 series, 14 series, 15 series, and the latest 16 series (including Plus, Pro, and Pro Max variants) .
• 4-in-1 Multi-functional Testing – Allows technicians to test the upper layer, lower layer, and the joined motherboard without repeatedly swapping flex cables or re-soldering jump wires, significantly speeding up the diagnostic process .
• Imported Pure Copper Gold-Plated Probes (0.5mm) – Utilizes high-quality probes with a 0.5mm diameter specification. The gold plating ensures excellent conductivity, corrosion resistance, and a reliable connection to the motherboard's test points, minimizing voltage drops during testing .
• CNC Precision Machining – Constructed using high-precision CNC (Computer Numerical Control) technology, ensuring the alignment of the probe pins matches the original factory PCB layout perfectly, reducing the risk of short circuits or misalignment .
• Durable Build Material – Made from carbon steel or alloy materials, offering a sturdy, heavy-duty base that prevents movement during testing .