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YCS 50g Solder Paste 138º
Ratings: 4
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The YCS 50g Solder Paste 138℃ is a professional-grade, low-temperature lead-free solder paste designed for precision electronics repair. With a melting point of 138℃, this paste is specifically formulated for heat-sensitive components, making it ideal for BGA reballing, CPU repair, and PCB assembly where standard solder temperatures could damage delicate components .
This 50g paste is engineered to meet the demands of modern electronics repair, particularly for mobile phone motherboard repairs, IC soldering, and scenarios where board warping or component damage is a concern. The formulation achieves high fluidity and stability, ensuring precise solder ball placement and reliable solder joints .
Key Features
- 138℃ Low Melting Point – Low-temperature formulation protects adjacent heat-sensitive components and prevents PCB warping during rework
- Excellent Anti-Oxidation Performance – Maintains integrity during heating, preventing oxidation that can compromise solder joint quality
- Non-Collapse Formula (Stable Viscosity) – Features a viscous, smooth consistency rated at 138/158/183 viscosity levels, ensuring no collapse or chip offset during placement
- Strong Wettability – Uniform and delicate texture with excellent wetting properties for quality soldering and desoldering repairs
- Low Residue / No-Clean – Leaves minimal flux residue after soldering, often requiring no post-solder cleaning
- Bright, Full Solder Joints – Produces shiny, high-strength solder joints with strong activity, resistant to poor welding or false welding
- Portable 50g Packaging – Compact size makes the paste easy to handle, store, and transport, ideal for both workshop use and field repairs
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