The YCS 50g Solder Paste 183℃ is a professional-grade, medium-temperature solder paste specifically formulated for general electronics soldering, BGA reballing, CPU repair, and PCB assembly. With a melting point of 183℃, this paste represents the industry standard for most electronics repair work, offering an optimal balance between thermal safety and soldering performance .

This 50g paste is engineered to meet the demands of professional repair technicians, particularly for mobile phone motherboard repairs, computer hardware soldering, and SMT patching. The formulation achieves high fluidity and stability, ensuring precise solder ball placement and reliable solder joints .

Key Features

• 183℃ Medium Melting Point – The classic eutectic melting point ideal for general electronics soldering and desoldering, offering excellent process control for most repair scenarios 
• Strong Wettability & Anti-Oxidation – Ensures the paste melts smoothly and spreads evenly across pads without burning or leaving carbonized residue. Contains added silver particles to enhance conductivity and reduce cold solder joints 
• Non-Collapse Formula (Stable Viscosity) – Features a thick, smooth consistency that does not collapse or shift during placement, ensuring BGA chips and components stay perfectly aligned during reflow 
• Low Residue / No-Clean Option – Leaves minimal flux residue after soldering. In most applications, no cleaning is required, saving valuable time on repairs 
• Bright, Full Solder Joints – Produces shiny, high-strength metallurgical joints with high resistance and strong activity, ensuring reliable electrical connections 
• Portable 50g Packaging – Compact size makes the paste easy to handle, store, and transport, ideal for both workshop use and field repairs