The YCS 50g Solder Paste 215℃ is a professional-grade, high-temperature lead-free solder paste specifically formulated for precision soldering and rework applications . With a melting point of 215°C, this paste is classified as a high-temperature solder paste, making it ideal for lead-free reflow profiles and applications requiring higher thermal stability .

This 50g paste is engineered to meet the demands of modern electronics repair, particularly for mobile phone motherboard repairs, BGA reballing, CPU soldering, and PCB assembly. The formulation achieves an optimal balance between fluidity and stability, ensuring precise solder ball placement and reliable solder joints .

Key Features

• 215°C High Melting Point – Lead-free formulation suitable for high-temperature reflow processes; meets RoHS environmental standards 
• Excellent Anti-Oxidation Performance – The paste maintains its properties even during prolonged heating, preventing oxidation that can compromise solder joint quality 
• Stable Viscosity (Non-Collapse Formula) – The paste features a thick, smooth consistency that does not collapse or cause component shift, ensuring components stay precisely in place during reflow 
• Bright, Full Solder Joints – Produces shiny, high-strength solder joints with strong activity for reliable electrical connections 
• Low Residue Formula – Leaves minimal flux residue after soldering, reducing post-solder cleaning requirements 
• Excellent Wettability – Strong wetting properties ensure smooth solder flow onto pads and component leads, reducing the risk of dry joints or false soldering 
• Portable 50g Packaging – Compact size makes the paste easy to handle, store, and transport, ideal for both workshop use and field repairs