The YCS Dragon Mobile Phone Repair Universal Silicone Mat is a professional heat-resistant magnetic work pad specially designed for BGA reballing, CPU repair, motherboard soldering, and mobile phone maintenance. Made from high-quality soft silicone material, this repair mat offers excellent heat resistance, anti-slip performance, and strong magnetic adsorption to securely hold steel mesh stencils during tin planting and soldering work. Its hollow heat dissipation design helps improve cooling efficiency and prevents stencil deformation during high-temperature repair operations, making it ideal for professional technicians and repair laboratories.

Features:

• Professional universal silicone repair mat for BGA and CPU work
• High-temperature resistant soft silicone material
• Strong magnetic adsorption for stable stencil positioning
• Anti-slip and easy-to-clean surface design
• Hollow heat dissipation structure for improved cooling performance
• Helps prevent stencil shifting and bulging during soldering
• Suitable for mobile phone motherboard, CPU, and IC repair
• Ideal for BGA reballing, tin planting, and micro soldering work
• Durable reusable design for long-term professional use
• Compact and lightweight repair workstation accessory