The 2UUL PadBall PB01 / PB02 Solder Balls are high-precision BGA solder balls used for microsoldering, reballing, and PCB pad repair in mobile phone motherboards. These tiny spherical solder particles are essential when restoring damaged or missing solder pads, especially in advanced repairs involving CPU, IC chips, and baseband circuits. They are widely used by technicians working under microscopes for board-level repair.

These solder balls are made from a Sn63/Pb37 alloy (tin 63% / lead 37%), which is a eutectic composition with a stable melting point of around 183°C. This ensures smooth melting, reliable solder joints, and minimal risk of overheating delicate components. The material also offers high conductivity and strong bonding strength, which is critical for restoring electrical connections on densely packed circuit boards.

One of the key advantages of the PadBall series is the uniform size and high precision of each solder ball, available in multiple diameters such as 0.2mm, 0.3mm, 0.45mm, 0.6mm, and 0.76mm. This allows technicians to match the correct size for different components and pads, ensuring accurate placement and reducing the risk of short circuits or bridging.