AMAOE BGA Android middle board tin planting positioning Platfrom Plate Set without magnetic Base
Ratings: 4
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The AMAOE BGA Android Middle Board Tin Planting Positioning Platform Plate Set is a professional reballing fixture designed for precise solder ball planting and BGA chip alignment on Android motherboards. This version comes without a magnetic base, making it ideal for technicians who already own a compatible base or require a lightweight positioning solution. The precision-machined platform ensures accurate chip placement and stable support during reballing and chip-level repair operations.
Key Features:
- Designed for Android motherboard BGA reballing and tin planting.
- Precision positioning plate for accurate chip alignment.
- Plate set version supplied without magnetic base.
- High-temperature resistant materials suitable for heating processes.
- Ensures stable support during solder ball placement and rework.
- Compatible with various Android motherboard repair applications.
- Precision-machined construction for improved repair accuracy.
- Durable and reusable design for long-term professional use.