AMAOE PD-A Universal Auxiliary Platform for Glue Removal and Tin Planting Suit
Ratings: 4
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The AMAOE PD-A Universal Auxiliary Platform is a professional-grade repair tool designed for mobile phone motherboard and chip-level work. It is mainly used during glue removal and tin planting (solder paste application) processes, especially in IC, CPU, and BGA reballing tasks. The platform provides a stable and accurate working base that helps technicians perform delicate repair operations with better control and precision. It is widely used in professional mobile repair workshops for improving efficiency and reducing errors during chip handling.
Key Features
• Designed for glue removal from IC, CPU, and motherboard chips during repair work
• Supports precise tin planting (solder paste application) for BGA reballing
• Ensures a stable, flat, and secure working surface for accurate operations
• Compatible with AMAOE stencil systems and multiple chip types and sizes
• Helps maintain perfect alignment between chip and stencil during work
• Reduces the risk of damage to pads, circuits, and delicate chip structures
• Improves accuracy and consistency in soldering and rework processes
• Built with durable, heat-resistant materials for long-lasting workshop use
• Suitable for advanced mobile phone motherboard and IC-level repairs
• Ideal for professional technicians, repair centers, and production-level rework tasks