MaAnt SL-1 Deicing By Magic Furnace for Mobile Phone PCB Motherboard Chip
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MaAnt SL-1 Deicing Magic Furnace for Mobile Phone PCB/Motherboard Chips
The MaAnt SL-1 Deicing Magic Furnace is a professional heating tool designed for removing adhesive, underfill, and chip bonding materials from mobile phone PCBs and motherboards. It is commonly used in IC, CPU, and NAND repair processes where controlled heating is required to safely loosen strong adhesive layers.
Its compact heating chamber provides stable temperature control, allowing technicians to process chips efficiently without damaging surrounding components.
Key Features:
- Controlled heating “magic furnace” design
- Effective removal of chip adhesive and underfill
- Stable and uniform temperature output
- Safe for PCB and motherboard components
- Compact and professional repair tool
- Suitable for IC, CPU, and NAND work
