Products you've recently viewed
Exclusive discounts Subscribe to our news and get a 10% discount coupon!
Ratings: 4

The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
MaAnt SL-1 Deicing Magic Furnace for Mobile Phone PCB/Motherboard Chips
The MaAnt SL-1 Deicing Magic Furnace is a professional heating tool designed for removing adhesive, underfill, and chip bonding materials from mobile phone PCBs and motherboards. It is commonly used in IC, CPU, and NAND repair processes where controlled heating is required to safely loosen strong adhesive layers.
Its compact heating chamber provides stable temperature control, allowing technicians to process chips efficiently without damaging surrounding components.
Key Features:
SKU: N/A
Model: N/A
Net Weight: 0 KG
Gross Weight: 0 KG
Variations: 1
Serial Number: N/A
Product Size: N/A
Package Size: N/A